MICROELECTRONICS TROUBLESHOOTING AND REPAIR AND MICROSOLDERING
24 - 26 AUGUST 2026
COURSE INTRODUCTION
This hands-on programme builds practical capability in microelectronics diagnosis, precision soldering and board-level repair. Participants learn to work with microscopes, identify SMD components, use micro-soldering tools, inspect fine-pitch assemblies and apply structured methods for safer, cleaner and more reliable repairs. Practical examples and guided discussion help participants connect the subject to decisions and challenges in their own workplace.
COURSE OBJECTIVES
By the end of this programme, participants should be able to:
- Set up a microscope and inspect high-density microelectronic assemblies safely.
- Identify, handle and test miniature SMD components.
- Select and maintain micro-soldering tools, tips, materials and cleaning agents.
- Solder and desolder fine-pitch components and connectors accurately.
- Repair lifted pads, damaged tracks, difficult joints and epoxy-covered areas.
- Diagnose low-voltage shorts, perform micro-BGA rework and verify completed repairs.
WHO SHOULD ATTEND
This programme is suitable for electronics technicians, engineers, maintenance personnel, repair specialists, technical supervisors and production support teams.
COURSE CONTENT
- Microscope setup and inspection of high-density microelectronic assemblies
- Identification, handling and testing of miniature SMD components
- Micro-soldering tools, materials, tip care and PCB cleaning
- Precision soldering and desoldering of fine-pitch components and connectors
- Repair of lifted pads, damaged tracks, difficult joints and epoxy-covered areas
- Micro-BGA reballing and rework of SMD integrated circuits
- NAND and eMMC device handling and programming fundamentals
- Diagnosis of direct and partial short circuits on low-voltage rails
- Hands-on board inspection, component replacement and repair verification
