HIGHER ADVANCED ELECTRONICS TROUBLESHOOTING, PROBLEM IDENTIFICATION AND REPAIR COURSE
21 - 23 OCTOBER 2026
COURSE INTRODUCTION
This advanced hands-on programme strengthens participants' ability to diagnose and repair complex electronic boards and high-density components. It covers precision soldering and desoldering, SMD and BGA rework, short-circuit detection, SMPS and ATX power-supply diagnostics, schematic tracing and the safe use of specialised repair equipment. Practical examples and guided discussion help participants connect the subject to decisions and challenges in their own workplace.
COURSE OBJECTIVES
By the end of this programme, participants should be able to:
- Perform precision soldering and desoldering on fine-pitch SMD and through-hole components.
- Set up and operate BGA rework equipment for removal, reballing and replacement.
- Locate short circuits, leakage and intermittent faults on high-density circuit boards.
- Trace SMPS, power-factor-correction and inverter circuits using schematics and measurements.
- Test advanced components and interpret their behaviour in-circuit and out-of-circuit.
- Complete board-level repairs and verify functional performance safely.
WHO SHOULD ATTEND
This programme is intended for experienced electronics repair professionals, including technicians, engineers, lecturers, technical students and repair specialists who meet the stated course prerequisites.
COURSE CONTENT
- Precision soldering and desoldering for SOIC, QFP, PLCC, PTH and SOT components
- BGA technology, rework-station operation and reballing
- Short-circuit and leakage detection on high-density circuit boards
- SMPS with power-factor-correction diagnostics and schematic tracing
- Standby, inverter, buck, boost and ATX power-supply circuits
- Advanced component testing and hands-on board repair
