COURSE INTRODUCTION
This advanced hands-on programme strengthens participants' ability to diagnose and repair complex electronic boards and high-density components. It covers precision soldering and desoldering, SMD and BGA rework, short-circuit detection, SMPS and ATX power-supply diagnostics, schematic tracing and the safe use of specialised repair equipment. Practical examples and guided discussion help participants connect the subject to decisions and challenges in their own workplace.
COURSE OBJECTIVES
By the end of this programme, participants should be able to:
- Explain the core concepts, terminology and working principles related to Higher Advanced Electronics Troubleshooting and Repair Course.
- Apply structured methods and industry good practices for Precision soldering and desoldering for SOIC, QFP, PLCC, PTH and SOT components, BGA technology, rework-station operation and reballing, and Short-circuit and leakage detection on high-density circuit boards.
- Evaluate relevant electronics situations and identify risks, gaps and improvement opportunities.
- Translate the learning into practical workplace actions and sound technical decisions.
COURSE OUTCOME
Upon completion, participants will be better prepared to:
- Assess relevant workplace situations using the concepts and methods covered in Higher Advanced Electronics Troubleshooting and Repair Course.
- Select and apply appropriate tools, checks or controls for Precision soldering and desoldering for SOIC, QFP, PLCC, PTH and SOT components, BGA technology, rework-station operation and reballing, and Short-circuit and leakage detection on high-density circuit boards.
- Recommend actions that support structured diagnostics, repair quality and confident hands-on workmanship.
- Communicate findings, improvement opportunities and next steps clearly to relevant stakeholders.
WHO SHOULD ATTEND
This programme is intended for experienced electronics repair professionals, including technicians, engineers, lecturers, technical students and repair specialists who meet the stated course prerequisites.
COURSE CONTENT
- Precision soldering and desoldering for SOIC, QFP, PLCC, PTH and SOT components
- BGA technology, rework-station operation and reballing
- Short-circuit and leakage detection on high-density circuit boards
- SMPS with power-factor-correction diagnostics and schematic tracing
- Standby, inverter, buck, boost and ATX power-supply circuits
- Advanced component testing and hands-on board repair
