Course Introduction
We ensure satisfaction in our training courses. If you think this training does not meet the objective as mentioned in the brochure, we will replace you with other training with the same or less value (valid 1 year).
PROBLEM IDENTIFICATION AND REPAIR COURSE
After you have attended this course, you will be able to:
Remove, align and solder SOIC, QFP, PLCC ICs with Gull Wing, Flat lead, L-lead, I-lead and J-lead
Remove and solder Plated-Through Hole (PTH) and SOT package components in a double-sid
Course Objectives
- of Soldering
- Factors to consider during soldering process
- Criteria of good solder joints
- Some common problem of BGA soldering
- Safety consideration for BGA soldering
- How to clean the board after soldering
- 11.45am- 1.00pm
- How to use and operate an Infra Red (IR) and Hot Air BGA rework station to extract BGA ICs
- 1.00pm-2.00pm
- Lunch break
- 2.00pm - 3.30pm
- 1) Reball the BGA IC (using Reball Stencil) with new BGA solder balls
- 2) How to use and operate an Infra-Red (IR) and Hot Air BGA rework station to install BGA ICs
- 3.30pm to 3.45pm
- 3.45pm to 4.45pm
- 1) Explanation about the two secrets in troubleshooting many types of mainboard/motherboard.
- 2) Learn the easy and simple way to find shorted/leaky components in a high-density components mainboard/motherboard with the help of the special test equipment in the market.
- 4.45pm to 5.00pm
- Question and Answer
- DAY 2DAY 2
- DAY 2
- 9.00am -10.45am
- How to accurately test/check on all kind of sizes and shape of Transformers/Inductors/Coils/Flybacks.